Boston Micro Fabrication (BMF) has expanded its microArch 3D printer series by introducing four advanced materials—3D Systems’ Figure 4 HI TEMP 300-AMB, BASF Ultracur3D 3280, and its proprietary HTF and SR resins. These materials enhance BMF’s ability to cater to industries such as aerospace, electronics, medical devices, and biotechnology, offering capabilities like high temperature resistance, biocompatibility, and precise mold creation.
The new materials support advanced applications, providing engineers with tools to produce accurate, high-performance components. Industry leaders like Makuta and Z-Axis Connector Company have already seen significant improvements in prototyping and production precision using BMF’s solutions.
Snapshot of the Four new available materials announced by Boston Micro Fabrication
3D Systems Figure 4 HI TEMP 300-AMB
This high-performance plastic is designed for extreme thermal conditions, offering a Heat Deflection Temperature (HDT) above 300°C. It combines excellent rigidity with visualization properties, making it ideal for HVAC components, motor enclosures, and low-pressure molding.
- Applications: HVAC, consumer appliances, motor enclosures, low-pressure molding.
- Benefits: HDT over 300°C, no secondary post-cure needed, superior rigidity.
BASF Ultracur3D 3280
A ceramic-filled resin providing high stiffness (Young’s modulus: 10 GPa) and a Heat Deflection Temperature above 280°C. Its low viscosity and stability make it suitable for tooling, molding, and wind tunnel testing.
- Applications: Tooling, wind tunnel testing, mold inserts.
- Benefits: High stiffness, temperature performance, stability, and ease of printing.
HTF (High-Temp)
A BMF-developed resin with high temperature resistance and biocompatibility. It is suitable for autoclave sterilization and flexible across aerospace, electronics, and biotech sectors, with an HDT of 152°C.
- Applications: Aerospace, electronics, biotechnology.
- Benefits: Biocompatible, autoclave sterilizable, greater flexibility.
SR (Sacrificial Resin)
A soluble resin designed for single-use molds, suitable for materials like polypropylene. It reduces costs in prototyping and low-volume production by simplifying micro-injection molding.
Benefits: Dissolves in sodium hydroxide, cost-effective.
Applications: Single-use molds, low-volume production, PDMS applications.
Unlocking New Possibilities for Micro Manufacturing
Each of these materials complements the unique capabilities of BMF’s microArch 3D printers, ensuring that industries like medical devices, electronics, and aerospace can continue to push the boundaries of what’s possible with micro-scale 3D printing.
“Before discovering BMF, Makuta struggled to find a cost-effective solution for prototyping due to the size and complexity of their molded parts. Traditional methods like aluminum or urethane molds often fell short in holding the required tolerances, and the expense of creating entirely new molds was prohibitive. Using BASF Ultracur3D 3280 on BMF’s microArch system, we were blown away by the impeccable finish and precision of the first 3D printed mold inserts we received. Not only were they able to reproduce intricate features flawlessly, but they also maintained the tight tolerances our projects demand,” said Taki Yamada, director of business dev, Makuta.
“Boston Micro Fabrication’s micro-precision 3D printing technology has completely transformed how we approach connector manufacturing. Previously limited to tolerances of 5 thousandths with traditional methods, BMF allowed us to achieve tolerances of 1 to 2 thousandths, opening new possibilities for compact, high-performance connectors. Their platform also enabled us to use 3D Systems Figure 4 HI TEMP 300-AMB material that can withstand temperatures up to 300°C, meeting the demands of standard electronic assembly processes, enhancing efficiency and allowing us to create more compact, innovative designs. With BMF, we’ve reduced time and costs while delivering precision and performance that surpass industry standards,” said George Glatts, owner, Z-Axis Connector Company.
